The OECD recently published THE CHIP LANDSCAPE, analyzing global wafer fabrication capacity. As of September 2025, China, Taiwan, South Korea, Japan, and the U.S. accounted for 87% of global operational wafer capacity.
- Process Nodes: South Korea’s capacity is concentrated in 6–22nm for memory chips; U.S. capacity is more diversified.
- Key Companies: The top 10 semiconductor companies account for ~50% of global wafer capacity. Production in Japan, South Korea, and Taiwan is highly concentrated; mainland China is more distributed.
- Chip Type Capacity:
- Power/discrete: China leads (6.28M WSPM)
- Analog: China leads (3.64M WSPM)
- Mature logic: China leads (4.23M WSPM/month)
- Advanced logic: Taiwan leads (1.55M WSPM/month)
- Commodity memory: South Korea leads (4.58M WSPM/month)
- Specialty memory: Taiwan leads (1.18M WSPM/month)
- Capacity Expansion:
- Mainland China: mature logic, power/discrete
- U.S. & Taiwan: advanced logic
- South Korea: commodity memory
- Fab Types:
- Commodity memory and advanced logic fabs are highly specialized
- Analog, mature logic, and specialty memory produced in “mixed-technology” fabs
- Most capacity remains domestic, though foreign fabs are increasing in some regions
Global wafer capacity is concentrated in a few economies and large companies, but chip type, process, and business model create complex distribution and growth potential.
